X. F. Wang, X. Wang, L. Song, W. Y. Xing, G. Tang, W. Z. Hu and Y. Hu (2013) Preparation and thermal stability of UV-cured epoxy-based coatings modified with octamercaptopropyl POSS. Journal/Thermochimica Acta 568 130-139. [In English]
Web link: http://dx.doi.org/10.1016/j.tca.2013.06.038
Keywords: Epoxy acrylate resin, Thermal stability, UV-curing, Thiol-ene, photopolymerization, Octamercaptopropyl polyhedral oligomeric, silsesquioxane, Nanocomposites, POLYHEDRAL OLIGOMERIC SILSESQUIOXANE, HYBRID MATERIALS, THIN-FILMS, RESINS, CHEMISTRY, BEHAVIOR, SILICON, PHOTOPOLYMERIZATIONS, POLYMERIZATION, NANOCOMPOSITES
Abstract: UV-curable epoxy acrylate (EA) modified with octamercaptopropyl polyhedral oligomeric silsesquioxane (OMP-POSS) was prepared via thiol-ene photopolymerization. The study of microscale combustion indicated that EA/POSS nanocomposite displayed both the slower heat release rate and lower total heat release. The result of thermal degradation of the cured films showed that OMP-POSS had a double effect on the thermal stability of EA due to its structure containing both the relatively weak mercapto moieties and the POSS core resistant to heat shock, the derivation from the former (thioether linkages) leading to the early decomposition of the nanocomposites whereas the latter providing the well protective effects on some moieties of EA like aromatic groups and on the carbonaceous char. The analysis for the residues of EA2 with 20 wt% OMP-POSS exhibited that POSS can well protect the carbonaceous char from thermal-oxidative degradation at 600 degrees C, but do not work at 800 degrees C. (C) 2013 Elsevier B.V. All rights reserved.